The effect of pumping methods on wet etching processes
04/04/2012
The effect of pumping methods on the etching of PE-TEOS wafers was investigated. Jung-Soo Lim, R. Prasanna Venkatesh, and Jin-Goo Park, Dept. of Ma...
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Defect removal using dry cryogenic aerosols
04/03/2012
The high particle removal efficiency of cryogenic aerosol cleans can provide yield advantages in the BEOL after in-line testing, without altering s...
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Semiconductor makers spend record amount on materials for second straight year
04/02/2012
The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenu...
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AMD and GLOBALFOUNDRIES form new agreement
04/01/2012
AMD amended its wafer supply agreement with GLOBALFOUNDRIES Inc., with a negotiated wafer price mechanism for 2012. |
Elpida files for bankruptcy
04/01/2012
Elpida Memory Inc. resolved to file a petition for the commencement of corporate reorganization proceedings at today's meeting of the board of dire...
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Top 25 semiconductor company rankings reveal big winners, big losers
The top 10 and top 25 semiconductor suppliers registered 7% and 4% growth, respectively. However, 15 of the top 25 semiconductor sales leaders post...
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Intel 22nm trigate transistor process chosen for next-gen Netronome flow processors
Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processor...
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Power electronics grow on SiC and GaN innovation
Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a...
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Top 5 counterfeited semiconductors: Analog ICs top the list
The top-5 most commonly counterfeit components (based on reported cases) are analog ICs, microprocessors, memory ICs, programmable logic devices, a...
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Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliability and stab...
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Delivering Optimized High Performance Computing Through Advanced Interconnects
The most important element in the microelectronics performance, be it low power, electrical performance or reliability, is the interconnect from the chip to ...
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The Coolest Compounds
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. I...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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