Terepac builds miniaturized embedded circuits with wireless connectivity
Apr 2, 2012
Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the "Internet of Things...
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Advanced packaging in the new decade
Apr 1, 2012
E. Jan Vardaman, Techsearch International |
Semiconductor wafer fab utilization rates bucked expectations in late 2011
Mar 29, 2012
The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package p...
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Cypress Semiconductor transfers back-end packaging lines to China
Mar 27, 2012
Cypress Semiconductor transferred 7 back-end semiconductor package assembly lines from its Philippines facility to Chinese packaging subcontractor Jiangsu Changjiang Electronics...
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TI adds bare die to small-quantity semiconductor packaging options
Mar 27, 2012
Texas Instruments Incorporated (TI, TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production ...
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Imec ultrathin chip packaging yields improved
Mar 23, 2012
Research organization imec introduces important changes to its ultrathin chip packaging (UTCP) technology, increasing yields 15-20%. |
Keithley Instruments upgrades semiconductor test software suite
Jan 26, 2012
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with se...
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BSE Group achieves milestones in semiconductor equipment financing biz
Jan 26, 2012
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Sem...
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Metallization processes for standardized wide-IO memory applications
Jan 26, 2012
A new generation of nanotechnology-based wet-process films provides process simplification, performance boost and cost reduction beyond TSVs. Claudio Truzzi,...
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3D MID sensor fabricated with Ticona laser-activated LCP circuits
Jan 25, 2012
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic ...
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Presto Engineering semiconductor service hub opens in Israel
Jan 24, 2012
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design communit...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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