MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel
Apr 5, 2012
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.
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Georgia Tech increases interposer development work
Apr 4, 2012
Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon an...
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Interposer ecosystem examined
Apr 1, 2012
Dr. Phil Garrou, Contributing Editor |
Common Technology Platform Forum looks to the future
Apr 1, 2012
The 2012 Common Platform Technology Forum took place March 14 at the Santa Clara Convention Center, with registration topping 1200 attend...
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Advanced packaging in the new decade
Apr 1, 2012
E. Jan Vardaman, Techsearch International |
Amkor licenses 3D packaging tech to SHINKO
Mar 30, 2012
Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold V...
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The effect of pumping methods on wet etching processes
Apr 4, 2012
The effect of pumping methods on the etching of PE-TEOS wafers was investigated. Jung-Soo Lim, R. Prasanna Venkatesh, and Jin-Goo Park, Dept. of Materials En...
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Henkel surface mount adhesive validated for non-contact dispensing
Apr 4, 2012
Henkel’s LOCTITE 3621 surface-mount adhesive (SMA) was validated for use with non-contact dispensing, or jetting, technologies. |
Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components
Apr 4, 2012
Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bondin...
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Ferro expands LTCC offering with cost-sensitive materials set
Apr 3, 2012
Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over ...
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Terepac builds miniaturized embedded circuits with wireless connectivity
Apr 2, 2012
Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the &quo...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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