MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel
04/05/2012
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND. |
Georgia Tech increases interposer development work
04/04/2012
Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging. |
Henkel surface mount adhesive validated for non-contact dispensing
04/04/2012
Henkel’s LOCTITE 3621 surface-mount adhesive (SMA) was validated for use with non-contact dispensing, or jetting, technologies. |
Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components
04/04/2012
Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications. |
Ferro expands LTCC offering with cost-sensitive materials set
04/03/2012
Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easie...
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Terepac builds miniaturized embedded circuits with wireless connectivity
04/02/2012
Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the "Internet of Things." |
Bruker bolsters CT imaging line with SkyScan buy
04/02/2012
Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs. |
Yamaichi enables embedded module test and programming with new test adapter
03/30/2012
Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM. |
Amkor licenses 3D packaging tech to SHINKO
03/30/2012
Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology. |
Fluendo Launches Moovida Universe Optimized for the Second-Generation AMD A-Series APU
San Francisco, CA, May 17, 2012 --(PR.com)-- Fluendo, a world leading multimedia software development company and GStreamer expert, announced tod...
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Vestel Electronics Launches Advanced Set-Top-Box Using Mentor Graphics Inflexion User Interface Technology
Mentor Graphics Corporation
(NASDAQ:MENT) today announced that Vestel Electronics, one of Europe's largest set-top-box (STB) manufacturers,...
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Vietnam's electronic products export on the rise
Vietnam's electronic industry has shifted from assembling consumer electronic products for domestic market to produce components and spare p...
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Mentor Graphics Corporation to Release Fiscal Q1 2013 Financial Results May 25, 2012
Mentor Graphics Corporation (NASDAQ:MENT) today announced they will release financial results for the company's first fiscal quarter, ended April...
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-eSolar Partners with Sanmina-SCI to Design Next-Generation Concentrated Solar Power Components
ENP Newswire - 16 May 2012
Release date- 14052012 - SAN JOSE AND BURBANK, Calif. - Two global companies, eSolar and Sanmina-SCI (Nasdaq: SAN...
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PVD Solutions for Next Generation MEMS and Sensors
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with ...
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FREE WEBCAST: Lens Tilt in Small Auto-Focus CamerasThis webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors. Sponsored by
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FREE WEBCAST: Light and Color Measurement of Today's LED TechnologyThe seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately. Sponsored by
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ESTC 2012Amsterdam, the Netherlands
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Global Interposer Technology Workshop at GA TechAtlanta, GA
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ITRI brings 3D packaging expertise to Rambus partnership
12/15/2011
Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...
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IPC, JEDEC devise package strain test
12/15/2011
IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...
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Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness
12/15/2011
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...
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Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
12/14/2011
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...
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